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4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
DESCRIPTION
The FOD817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.
FEATURES
* Applicable to Pb-free IR reflow soldering * Compact 4-pin package * Current transfer ratio in selected groups: FOD817: 50-600% FOD817A: 80-160% FOD817B: 130-260% FOD817C: 200-400% FOD817D: 300-600% * C-UL, UL and VDE approved * High input-output isolation voltage of 5000 Vrms
4
1
FUNCTIONAL BLOCK DIAGRAM
ANODE 1
4 COLLECTOR
APPLICATIONS
FOD817 Series * Power supply regulators * Digital logic inputs * Microprocessor inputs
CATHODE 2 3 EMITTER
ABSOLUTE MAXIMUM RATINGS (TA = 25C Unless otherwise specified.)
Parameter TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation EMITTER Continuous Forward Current Reverse Voltage LED Power Dissipation Derate above 25C DETECTOR Collector-Emitter Voltage Emitter-Collector Voltage Continuous Collector Current Detector Power Dissipation Derate above 25C Symbol TSTG TOPR TSOL PD IF VR PD VCEO VECO IC PD Value -55 to +125 -30 to +100 260 for 10 sec 200 50 6 70 0.93 70 6 50 150 2.0 Units C C C mW mA V mW mW/C V V mA mW mW/C
(c) 2004 Fairchild Semiconductor Corporation
Page 1 of 9
8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
ELECTRICAL CHARACTERISTICS (TA = 25C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter EMITTER Input Forward Voltage Reverse Leakage Current Terminal Capacitance DETECTOR Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current *Typical values at TA = 25C. Test Conditions (IF = 20 mA) (VR = 4.0 V) (V = 0, f = 1 kHz) (IC = 0.1 mA, IF = 0) (IE = 10 A, IF = 0) (VCE = 20 V, IF = 0) Symbol VF IR Ct BVCEO BVECO ICEO Min -- -- - 70 6 -- Typ* 1.2 -- 30 -- - - Max 1.4 10 250 -- - 100 Unit V A pF V V nA
TRANSFER CHARACTERISTICS (TA = 25C Unless otherwise specified.)
DC Characteristic Test Conditions Symbol Device FOD817 FOD817A Current Transfer Ratio (IF = 5 mA, VCE = 5 V) (note 1) CTR FOD817B FOD817C FOD817D Collector-Emitter Saturation Voltage AC Characteristic Rise Time Fall Time (IC = 2 mA, VCE = 2 V, RL = 100) (note 2) (IC = 2 mA, VCE = 2 V, RL = 100) (note 2) tr tf -- -- 4 3 18 18 s s (IF = 20 mA, IC = 1 mA) VCE (SAT) Min 50 80 130 200 300 -- Typ* -- -- -- -- -- 0.1 Max 600 160 260 400 600 0.2 Unit % % % % % V
ISOLATION CHARACTERISTICS
Characteristic Input-Output Isolation Voltage (note 3) Isolation Resistance Isolation Capacitance *Typical values at TA = 25C. NOTES 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2. For test circuit setup and waveforms, refer to page 4. 3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common. Test Conditions f = 60Hz, t = 1 min (VI-O = 500 VDC) (VI-O = 0, f = 1 MHz) Symbol VISO RISO CISO Min 5000 5x 1010 1011 0.6 1.0 Typ* Max Units Vac(rms) pf
(c) 2004 Fairchild Semiconductor Corporation
Page 2 of 9
8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
60 FORWARD CURRENT IF (mA) 50 40 30 20 10 0 -30 COLLECTOR POWER DISSIPATION PC (mW)
Fig. 1 Forward Current vs. Ambient Temperature
Fig. 2 Collector Power Dissipation vs. Ambient Temperature
200
150
100
50
0 25 50 70 100 125 AMBIENT TEMPERATURE TA (C)
0 -30
0 25 50 70 100 125 AMBIENT TEMPERATURE TA (C)
Fig. 3 Collector-Emitted Saturation Voltage vs. Forward Current
6 COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V)
1m A 3m A 5m A 7m A
Ta = 25C
Fig. 4 Forward Current vs. Forward Voltage
500 FORWARD CURRENT IF (mA) 200 100 50 20 10 5 2
Ta =75C 50C 25C 0C -25C
5 4 3 2 1 0 0
1 5 10 15 0 0.5 1.0 1.5 2.0 2.5 3.0 FORWARD CURRENT IF (mA) FORWARD VOLTAGE VF (V)
Fig. 5 Current Transfer Ratio vs. Forward Current
CURRENT TRANSFER RATIO CTR ( %) 200 COLLECTOR CURRENT IC (mA) 180 160 140 120 100 80 60 40 20 0 1 2 5 10 20 50
VCE = 5V Ta = 25C
Fig. 6 Collector Current vs. Collector-Emitter Voltage
30
I IF = 30mA Ta = 25C 20mA Pc(MAX.)
25 20 15
10mA
10
5m A
5 0
0
1
2
3
4
5
6
7
8
9
FORWARD CURRENT IF (mA)
COLLECTOR-EMITTER VOLTAGE VCE (V)
(c) 2004 Fairchild Semiconductor Corporation
Page 3 of 9
8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
Fig. 7. Relative Current Transfer Ratio vs. Ambient Temperature
RELATIVE CURRENT TRANSFER RATIO (%)
Fig. 8 Collector-Emitter Saturation Voltage vs. Ambient Temperature
COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -25 0 25 50 75 100 AMBIENT TEMPERATURE TA (C)
150
IF = 5mA VCE = 5V
100
IF = 20mA IC = 1mA
50
0 -30
0 25 50 75 100 AMBIENT TEMPERATURE TA (C)
COLLECTOR DARK CURRENT ICEO (A)
Fig. 9 Collector Dark Current vs. Ambient Temperature
10-5 500
Fig. 10. Response Time vs. Load Resistance
VCE = 2V 200 IC = 2mA Ta = 25C 100
50 20 10 5 2 1 0.5
VCE = 20V
10-6 RESPONSE TIME (s) 10-7 10-8 10-9 10-10 10-11 -25
tr tf td ts
0 25 50 75 100 AMBIENT TEMPERATURE TA (C)
0.2 0.05
0.1 0.2
0.5
1
2
5
10
LOAD RESISTANCE RL (k)
Fig. 11. Frequency Response
VCE = 2V IC = 2mA Ta = 25C
Test Circuit for Response Time
VOLTAGE GAIN AV (dB)
0
10
RL=10k 1k 100
20
Test Circuit for Frequency Response
2 5 10 20 50 100 500
0.5 1
FREQUENCY f (kHz)
(c) 2004 Fairchild Semiconductor Corporation
Page 4 of 9
8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
Package Dimensions (Through Hole)
0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00)
Package Dimensions (Surface Mount)
0.312 (7.92) 0.288 (7.32)
SEATING PLANE
0.157 (4.00) 0.118 (3.00)
SEATING PLANE
0.200 (5.10) 0.161 (4.10)
0.200 (5.10) 0.161 (4.10)
0.276 (7.00) 0.236 (6.00)
0.157 (4.00) 0.118 (3.00) 0.010 (0.26)
0.130 (3.30) 0.091 (2.30)
0.051 (1.30) 0.043 (1.10)
0.020 (0.51) TYP
0.024 (0.60) 0.004 (0.10)
0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86)
0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40)
0.010 (0.26) 0.300 (7.62) typ
0.110 (2.79) 0.090 (2.29) Lead Coplanarity 0.004 (0.10) MAX
0.110 (2.79) 0.090 (2.29)
Package Dimensions (0.4" Lead Spacing)
0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00)
Footprint Dimensions (Surface Mount)
1.5 1.3
SEATING PLANE
0.200 (5.10) 0.161 (4.10)
0.130 (3.30) 0.091 (2.30) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.110 (2.80) 0.011 (1.80)
0.291 (7.40) 0.252 (6.40)
9
0.010 (0.26)
2.54
NOTE All dimensions are in inches (millimeters)
(c) 2004 Fairchild Semiconductor Corporation
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4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
ORDERING INFORMATION
Option S SD W 300 300W 3S 3SD Order Entry Identifier .S .SD .W .300 .300W .3S .3SD Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
4
5
V X ZZ Y
3
6
817
1
2
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code Two digit work week ranging from `01' to `53' Assembly package code
(c) 2004 Fairchild Semiconductor Corporation
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8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
Carrier Tape Specifications
O1.550.05 P2 P0 1.750.1
F W
P1
0.30.05
NOTE All dimensions are in millimeters
Description Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment
Symbol W P0 F P2 P1
Dimensions in mm (inches) 16 0.3 (.63) 4 0.1 (.15) 7.5 0.1 (.295) 2 0.1 (.079) 12 0.1 (.472)
(c) 2004 Fairchild Semiconductor Corporation
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8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
Lead Free recommended IR Reflow condition
Tp
Temperature (C)
Tsmax
Ramp-down
Tsmin
25C ts (Preheat) Time (sec)
Profile Feature Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate Pb-Sn solder assembly 100C ~ 150C 60 ~ 120 sec 183C 60 ~ 120 sec 240 +0/-5C 6C/sec max. Lead Free assembly 150C ~ 200C 60 ~120 sec 217C 30 ~ 90 sec 250 +0/-5C 6C/sec max.
Soldering zon
Recommended Wave Soldering condition
Profile Feature Peak temperature (Tp) For all solder assembly Max 260C for 10 sec
(c) 2004 Fairchild Semiconductor Corporation
Page 8 of 9
8/19/04
4-PIN PHOTOTRANSISTOR OPTOCOUPLERS FOD817 Series
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2004 Fairchild Semiconductor Corporation
Page 9 of 9
8/19/04

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